1. Processor (CPU

Number of slots: 2

Supported processor: 3rd Generation Intel® Xeon® Scalable Processor (Ice Lake)

Maximum number of cores: A single CPU has a maximum of 40 cores (such as Xeon Platinum 8380)

TDP support: Up to 270W/CPU

Acceleration instruction set: Supports AVX-512, Intel DL Boost (AI acceleration)

2. Memory (RAM)

Number of slots: 32 DDR4 DIMMs (8 channels)

Maximum capacity: 8TB (Single 256GB LRDIMM)

Frequency support: 3200MHz

3. Storage configuration

Front drive

12 2.5-inch hot-swappable NVMe SSDS (U.2 interface)

Optional 24 2.5-inch configurations (mixed SAS/SATA/NVMe)

RAID support:

Huawei ES3600 series RAID card (Supporting RAID 0/1/5/6/10/50/60)

Optional supercapacitor protection (ensuring the security of cache data)

4. Liquid cooling heat dissipation system

Cooling method:

Direct chip-level liquid cooling (D2C) : Full liquid cooling coverage for CPU, memory, and NVMe

Cold plate material: High thermal conductivity copper alloy, corrosion-resistant design

Energy efficiency performance

PUE ≤1.1 (saves more than 40% energy compared with air cooling)

Supports 45℃ high-temperature water inflow (adapted to global climate)

Pipeline design

Quick plug and unplug interface, maintenance time ≤5 minutes

Leakage detection sensor (real-time alarm)

5. Expansion capability

PCIe slot

6 PCIe 4.0 x16 (supporting full height and full length)

Compatible with GPU accelerator cards such as NVIDIA A100/T4

Network interface

It is equipped with 4 25GbE (Huawei self-developed smart network cards) on board.

Optional 100Gb InfiniBand or OCP 3.0 network card is available

6. Power Supply and Power supply

Power module

240V high-voltage direct current (HVDC) input (efficiency ≥96%)

Optional 380V AC titanium power supply

Power supply architecture

Full redundancy design (N+1 power supply)

Support battery backup unit (BBU)

7. Management and Monitoring

Intelligent management system

Huawei iCooling energy efficiency optimization Algorithm (Real-time adjustment of pump speed/flow rate)

FusionDirector Centralized Management (Multi-node liquid cooling system monitoring)

Sensor network

Three-mode monitoring of temperature/pressure/flow (accuracy ±1%)

The leakage location accuracy is ≤5cm

8. Physical Specifications

Dimensions: 2U rack-mounted (87.5mm high × 447mm wide × 800mm deep)

Weight: ≤35kg (fully equipped with liquid cooling module)

Cabinet compatibility

Supports Huawei FusionPoD liquid-cooled cabinets (with a maximum heat dissipation capacity of 50kW per cabinet)

9. Software Ecosystem

Operating system

Huawei EulerOS, CentOS, Ubuntu

Virtualization platforms (VMware ESXi, Kubernetes)

Monitoring interface:

Open the Redfish API to support the integration of third-party management platforms

10. Typical application scenarios

Supercomputing center (scenarios with strict PUE compliance requirements)

AI training cluster (High-density GPU computing power pool)

Financial high-frequency trading (low latency and stable operation)

Core competitive advantage

✔ Full-stack liquid cooling: chip-level precise cooling, fanless design

✔ Ultimate energy efficiency: PUE as low as 1.1, TCO reduced by 30%