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XC7Z030-3FFG676E

Short Description:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 1GHz 676-FCBGA (27x27)


  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Number of I/O: 130
  • Speed: 1GHz
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Series: Zynq®-7000

Product Details


FEATURES

► Device Family: Zynq-7000

► Package Type: 676-ball Fine-Pitch Ball Grid Array (FBGA)

► Speed Grade: -3 (standard performance)

► Logic Cells: 85,000

► I/O Pins: Up to 400 I/O pins

► Block RAM: 4.9 Mb of Block RAM

► DSP Slices: 220 DSP slices for high-performance digital signal processing

► Processing System (PS):

► ARM Cortex-A9: Dual-core ARM Cortex-A9 processor with clock speeds up to 866 MHz

► Memory Interfaces: Supports DDR3, DDR3L, and LPDDR2 memory

► Programmable Logic (PL):

► Logic Cells: Provides a range of logic resources and configurable I/O for custom hardware designs

► Clock Management: Includes Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for flexible clocking

► Configuration Options: Supports various configuration modes including JTAG, SPI, and parallel

► Power Management: Advanced power management features to optimize power consumption and thermal performance


APPLICATIONS

► Embedded Systems

► Networking and Communication

► High-Performance Computing

► Digital Signal Processing (DSP)

► Prototyping and Development

► Consumer Electronics



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