XC7Z030-3FFG676E
FEATURES
► Device Family: Zynq-7000
► Package Type: 676-ball Fine-Pitch Ball Grid Array (FBGA)
► Speed Grade: -3 (standard performance)
► Logic Cells: 85,000
► I/O Pins: Up to 400 I/O pins
► Block RAM: 4.9 Mb of Block RAM
► DSP Slices: 220 DSP slices for high-performance digital signal processing
► Processing System (PS):
► ARM Cortex-A9: Dual-core ARM Cortex-A9 processor with clock speeds up to 866 MHz
► Memory Interfaces: Supports DDR3, DDR3L, and LPDDR2 memory
► Programmable Logic (PL):
► Logic Cells: Provides a range of logic resources and configurable I/O for custom hardware designs
► Clock Management: Includes Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for flexible clocking
► Configuration Options: Supports various configuration modes including JTAG, SPI, and parallel
► Power Management: Advanced power management features to optimize power consumption and thermal performance
APPLICATIONS
► Embedded Systems
► Networking and Communication
► High-Performance Computing
► Digital Signal Processing (DSP)
► Prototyping and Development
► Consumer Electronics