FEATURES

► Device Family: Zynq-7000

► Package Type: 900-ball Fine-Pitch Ball Grid Array (FBGA)

► Speed Grade: -2 (standard performance)

► Logic Cells: 126,000

► I/O Pins: Up to 450 I/O pins

► Block RAM: 7.2 Mb of Block RAM

► DSP Slices: 280 DSP slices for high-performance digital signal processing

► Processing System (PS):

► ARM Cortex-A9: Dual-core ARM Cortex-A9 processor with clock speeds up to 866 MHz

► Memory Interfaces: Supports DDR3, DDR3L, and LPDDR2 memory interfaces

► Programmable Logic (PL):

► Logic Cells: Provides a wide range of logic resources and configurable I/O for custom hardware designs

► Clock Management: Includes Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for flexible clocking and timing solutions

► Configuration Options: Supports various configuration modes including JTAG, SPI, and parallel

► Power Management: Advanced power management features for optimized power consumption and thermal management

APPLICATIONS

► Embedded Systems

► Networking and Communication

► High-Performance Computing

► Digital Signal Processing (DSP)

► Prototyping and Development

► Consumer Electronics